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Title: ERF 052711-1 Pressure Sensor Process Kit Wafers

Read the request thoroughly BEFORE starting.  Ask questions if anything is not clear.  We want to be as efficient as possible.

Disposition: Completed week of June 20.  Lesson Learned: the wafer mask set needed to be better specified by Matt, Harold used the old 6in wafer 3x3 mask instead of the 4in wafer 3x3 mask w/ snaplines.  April wasn't yet on board for this.   In this case, it didn't matter as we can use the other wafers.

Originator: Dr. Pleil

Date of Request: 5/27/2011

When due:6/6/2011

Who is requested: Harold Madsen/April Lujan

Why (purpose): Provide chips for 50 Pressure Sensor Process Kits, 2 chips from each of ten steps. 

Where (fab, office..): MTTC Fab

What (deliverables): Wafers in a labeled box if not diced, diced wafers preferred but can be done at USF.

How (suggested process details):

Use the four inch Silicon Nitride wafers already available.

Use the 3x3 mask - we can leverage the snap line mask if this is easier for you Harold.  Your call.

Each 3x3, 4in wafer layout has 52 chips on it.  We need a total of 100 chips, minimum for this project.  However, it is good to have extra chips in case there are yield issues, hence, I'm requesting 4 wafers from each layer, if we dice well, only two wafers need to be diced now.

We need to have 4 wafers at each of the following inspection (process) points (36 Nitride wafers)

1. Bare Silicon - NO NITRIDE

2. Silicon Nitride - NO PATTERN

3. Patterned Backside Photolithography (Through Develop)

4. Backside Etch (RIE) - (Through etch but with resist still on)

5. Backside Photoresist Strip - (Through resist strip)

6. Patterned Frontside Lithography (Through Develop)

7. Metal Deposition (Through Deposition)

8. Metal Lift-off (After Liftoff, but still with LOR, before develop)

9. LOR Strip - (After Strip and Clean)

10. KOH Etch - Final wafer

Pitch for dicing:

 10639.75 in x (flat down)

 10638.7566 y (flat down)

Title: Engineering Request 052711-2

Read the request thoroughly BEFORE starting.  Ask questions if anything is not clear.  We want to be as efficient as possible.

Disposition: Wafer was with the wrong mask, received during the week of 6/20.  No alignment marks on the backside.  Lesson Learned: Matt need to specify what masks to use in the future.  Requested a second attempt on 7/5/2011.  April was not yet on board when this was done, but is now.  MWP 7/5/11

Originator: Matthias Pleil

Date of Request: 5/27/2011

When due:6/6/2011

Who is requested: Harold Madsen/April Lujan

Why (purpose): Need one wafer for NDSCS to experiment with utilizing IR backside alignment

Where (fab, office..): MTTC Fab

What (deliverables): one 4in nitride wafer with the 3x3 membrane pattern on the back (include the mask that has the snap lines if available).  Coat the front of the wafer as we would for the front side lift off process, but don't pattern.  NDSCS will take the wafer and work with OAI trying to see if the IR system could work.

How (suggested process details):

Standard backside Pressure sensor process through Nirtide etch.  Add front side LOR / Coat layers.  Do Not Pattern the front side.

Matt will ship to NDSCS.

Title: Engineering Request 070511-1

Read the request thoroughly BEFORE starting.  Ask questions if anything is not clear.  We want to be as efficient as possible.

Make sure you scroll down to see the entire request!

Originator: Matthias Pleil

Date of Request: 7/5/2011

When due: ASAP - need chips for packaged part - no later than July 18, sooner is much better in case a rework is required.  Cosmiac will be packaging/testing and we will use at HI TEC workshop.

Who is requested: April Lujan w/ assistance from Harold Madsen

Why (purpose): Need one wafer for HI TEC and the packaging project.

Where (fab, office..): MTTC Fab

What (deliverables): One completed NiCr sputtered pressure sensor wafer using Khawar's modified pressure sensor process utilizing the latest mask revision - see below.

How (suggested process details):

Use Khawar's PS Process with NiCr Sputter to make one wafer.  Use the appropriate mask set.  The backside (Membrane) mask IS DIFFERENT from those we used in the past; it only has one large opening per field.  The front-side (Gold) mask is also DIFFERENT, instead of the 3x3 field, we have ONE DIE PER FIELD.  See the Wafer Layout and close-up of the wafer center.  Note that there are 4 different die layouts per wafer quadrant.  You should not have to dice if you use the correct backside.  Note that we have done the experiment before and the NiCr does NOT come off in the KOH etch!

For details, see the .dwg file: 1x1_5in_mask_PS_Khawar.dwg, you can request this from Matt.

Please call Matt on his cell if you have any questions!  Leave a message if I can't answer.

We need to break apart the wafer (chips) and give 6 of each type to COSOMIAC for packaging and testing.  Hold the rest for future packaging.

Pressure Sensor for Packaging 2011Pressure Sensor Package 2011 Close Up

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